Dicing process

While dicing/singulation, wafer or substrates will be singulated according to predetermined design.

This job is done by high precision machines with highest accuracy and tools with excellent cutting abilities and tolerances.

From machines like wafer dicing saws and peripheral systems like mounter, chiller, filters, UV-curing up to consumables like blades, tape, water additives, rings and frames MINITRON offers the whole range of products needed around the dicing process.