Snap rings

Rings consisting of two parts and made from polycarbonate secure your tape.
Mostly they are used for fixing the tape while expanded. This step is mostly done after the dicing process. The rings are snapped between wafer and frame. 
Sometimes they are already used during dicing. In this case the tape will be spanned between the rings and the wafer will be mounted on that tape.

We supply rings for all Wafer sizes ex stock.

Wafer frames

You would like to fix your wafer onto the tape during dicing?
We provide wafer frames for all wafer sizes in plastic and stainless steel.