Wafermounter UH114 / UH115

Both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses.

Ultron mounters are available in 6″, 8″, and 12″ wafer / film frame models.

UH115 Series based on the Model UH114 Series Wafer/Frame Film Applicators. The Model UH115 Series Mounters feature a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates.

Wafermounter Ultron UH108

Ultron Systems’ Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer — including the alignment flats — within 0.005″ in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.

Wafermounter Ultron UH110

Ultron Systems’ Model UH110 and UH110-8 Semiautomatic Film Removers demount film from 3″ to 8″ wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields.
Both systems outperform time-consuming hand removal at a fraction of the cost of fully automatic equipment.

Wafermounter ADT 967 – Halbautomat

Fast, accurate and bubble-free mounting.

ADT 967 Semi-Automatic Wafer Mounting System is designed to automatically mount wafers on tape.

Ultron UV Curing System UH104

The models of the UH104 Series UV Curing Systems are the most cost-effective UV tape exposure solutions on the market. Despite their low cost, these units offer the same uniformity of UV exposure and fast UV curing times as other semiautomatic and automatic high-end UV curing systems. In addition, the Models UH104-8 and UH104-12 feature a new environmentally safe, ozone-free UV lamp array with a cool, low-temperature UV-A 365nm curing process.

Ultron UV Curing System UH105

LED light-curing technology offers significant benefits over conventional lamp-based UV curing systems including lower operating costs and instant startup for on-demand curing.

ADT UV Curing System 955

ADT UV Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.

The systems are offered in two basic configurations of round wafer up to 8″ and 12″.

Microsnap Knuckle Joint Press 102

To assemble dicing rings, to mount tape or expand wafers after dicing. Options available to work off reels or with pre-cut tape.

The expander is for three kinds of applications

• Fix dicing tape on rings
• Expanding of diced wafers, diced on rings
• Expanding of diced wafers on frames

Ultron UH130

The UH130 series Die Matrix Expander incorporates

1) Flexiblity in both accommodation and adjustability

2) Accuracy and precision for repeatable results

3) Simplicity in operation. Die separation distance is precisely controlled.

ADT 977 Wafer Cleaner

is designed for cleaning workpieces after dicing. The systems are offered in different basic configurations, up to 8″ and 12″ round wafer.

Minitron Chiller mtt2012

Air bearing spindles produce heat. Process water treatment produces heat. mtt2012 provides the cooling. It is a chiller system with specially selected circulation pumps to take out the heat to provide cool results.

ADT 947 CO2 Injector

High quality processing, contamination-free devices.

The CO2 Bubbler is designed to eliminate particle adhesion and device damage caused by electrostatic effects. The units dissolve CO2 gas into de-ionized water (DI) used for dicing or cleaning processes, thus performing consistent control over an optimal level of resistivity.

ULTRA t Cleaner

Ultra T Equipment manufactures manual single/double-sided cleaning systems and other related equipment for the semiconductor and microelectronic industries.